A smaller area means more chips per silicon wafer and those smaller chips were less likely to encounter a defect during fabrication.

The silicon wafer serves as the gate electrode.

This affects a positive volume charge in the silicon wafer on the opposite side.

The glass layers are deposited by sputtering, spin-on of a glass solution or vapor deposition upon the processed silicon wafer.

It was also found that a silicon wafer with medium to low porosity displayed more stability.