system in package

system in package

A complete system packaged in one housing. A system in package (SiP) contains several ICs (chips) including a microprocessor on a single substrate such as ceramic or laminate. A SiP is really a multichip module (MCM) that contains all the parts of a complete system. The SiP term was first used by Amkor Technology in the late 1990s and not trademarked in order to encourage its use worldwide. See SoC and MCM.

System In Package
This cross section of a SiP shows a microprocessor (µP), SRAM and flash memory chips packaged together in the same housing. The L,R,C stands for inductor, resistor, capacitor. (Image courtesy of Amkor Technology, Inc.)