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thermocompression bonding
释义
thermocompression bonding
thermocompression bonding
[
¦thər·mō·kəm′presh·ən ′bänd·iŋ
]
(engineering)
Use of a combination of heat and pressure to make connections, as when attaching beads to integrated-circuit chips; examples include wedge bonding and ball bonding.
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sizzlingly
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更新时间:2025/2/1 2:43:33