| 释义 |
DictionarySeepolyimidetape automated bonding
tape automated bondingA process that places bare chips onto a printed circuit board (PCB) by first attaching them to a polyimide film. The film is moved to the target location, and the leads are cut and soldered to the board. Also called a "tape carrier package" (TCP), the bare chip is then encapsulated ("glob topped") with epoxy or plastic. See chip on board.
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| After the chip leads are cut and soldered to the board, the chip is covered with a glob of epoxy or plastic. (Illustration courtesy of Joseph Fjelstad.) |
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